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COMe-bCL6
COM EXPRESS® BASIC TYPE 6 WITH 8TH/9TH GENERATION INTEL® CORE™ / XEON® PROCESSORS SPECIFICATIONS
  • Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
  • Up to 128 GByte DDR4 non-ECC/ECC memory
  • Optional NVMe SSD onboard
  • Industrial grade versions
  • Support of Kontron’s Embedded Security Solution (APPROTECT)
 
 
Compliance COM Express® basic, Pin-out Type 6
Dimensions (H x W x D) 125 x 95 mm
CPU Intel® Xeon® 8th Gen E-2176M, 6x 2.7 GHz (4.4 GHz), GT2, 45/35 W
Intel® Core™ 8th Gen i7-8850H, 6x 2.6 GHz (4.3 GHz), GT2, 45/35 W
Intel® Core™ 8th Gen i5-8400H, 4x 2.5 GHz (4.2 GHz), GT2, 45/35 W
Intel® Core™ 8th Gen i3-8100H, 4x 3.0 GHz, GT2, 45/35 W
Intel® Xeon® 9th Gen E-2276ME (6x 2.8 GHz, GT2, 45W/35W)
Intel® Xeon® 9th Gen E-2276ML (6x 2.0 GHz, GT2, 25W)
Intel® Xeon® 9th Gen E-2254ME (4x 2.6 GHz, GT2, 45W/35W)
Intel® Xeon® 9th Gen E-2254ML (4x 1.7 GHz, GT2, 25W)
Intel® Core™ 9th Gen i7-9850HE (6x 2.7 GHz, GT2, 45W/35W)
Intel® Core™ 9th Gen i7-9850HL (6x 1.9 GHz, GT2, 25W)
Intel® Core™ 9th Gen i3-9100HL (4x 1.6 GHz, GT2, 25W)
Intel® Pentium™ 9th Gen G5600E (2x2.6 GHz, GT2, 35W)
Intel® Celeron® 9th Gen G4930E (2x2.4 GHz, GT2, 35W)
Intel® Celeron® 9th Gen G4932E (2x1.9 GHz, GT2, 25W)
CHIPSET Intel® Mobile CM246 (Xeon®) / Intel® Mobile QM370 (Core™)
GRAPHICS CONTROLLER

Intel® HD Graphics P630 for Xeon® processor

Intel® HD Graphics 630 for Core™ processors

ETHERNET CONTROLLER Intel® I219LM
ETHERNET 10/100/1000 MBit Ethernet
Main Memory 2x DDR4 SODIMM for up to 32 GByte ECC / non ECC
on request: 4x DDR4 SODIMM for up to 64 GByte ECC / non ECC
Ethernet Controller Intel® I210IT (uses one lane of PCIe 3.0)
Intel® Quad 10GbE LAN integrated in SoC
Ethernet

1x 10/100/1000 MBit Ethernet

Up to 4x 10GbE  Interfaces (KR) - depending on C3000 SKU

NC-SI support

Hard Disk 4x SATA 6Gb/s
Flash Onboard Up to 1 TByte NVMe SSD (on request)
PCI EXPRESS® SUPPORT 8x PCIe x1, 1x PEG x16
Serial 2x serial interface (RX/TX only)
PANEL SIGNAL DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit
USB 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0
AUDIO Intel® High Definition Audio
Serial 2x serial interface (RX/TX only)
COMMON FEATURES SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe
BIOS AMI Aptio V
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
FEATURES ON REQUEST vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM370 Chipset, 3rd/4th DDR4 SO-DIMM socket, NVMe SSD
Power Management ACPI 6.0
Power Supply ATX, 8.5V - 20 V Wide Range, Single Supply Power
Special Features
POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane configuration by Setup Option, Rapid shutdown (R E2S variants)
Operating System

Windows® 10, Linux, VxWorks

Temperature Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating
Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Supported Modules COMe-bCL6(R E2S) xx-xxxxx CM246/QM370
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