Compliance |
COM Express® basic, Pin-out Type 6 |
Dimensions (H x W x D)
| 125 x 95 mm |
CPU
|
Intel® Xeon® 8th Gen E-2176M, 6x 2.7 GHz (4.4 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i7-8850H, 6x 2.6 GHz (4.3 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i5-8400H, 4x 2.5 GHz (4.2 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i3-8100H, 4x 3.0 GHz, GT2, 45/35 W Intel® Xeon® 9th Gen E-2276ME (6x 2.8 GHz, GT2, 45W/35W) Intel® Xeon® 9th Gen E-2276ML (6x 2.0 GHz, GT2, 25W) Intel® Xeon® 9th Gen E-2254ME (4x 2.6 GHz, GT2, 45W/35W) Intel® Xeon® 9th Gen E-2254ML (4x 1.7 GHz, GT2, 25W) Intel® Core™ 9th Gen i7-9850HE (6x 2.7 GHz, GT2, 45W/35W) Intel® Core™ 9th Gen i7-9850HL (6x 1.9 GHz, GT2, 25W) Intel® Core™ 9th Gen i3-9100HL (4x 1.6 GHz, GT2, 25W) Intel® Pentium™ 9th Gen G5600E (2x2.6 GHz, GT2, 35W) Intel® Celeron® 9th Gen G4930E (2x2.4 GHz, GT2, 35W) Intel® Celeron® 9th Gen G4932E (2x1.9 GHz, GT2, 25W) | CHIPSET |
Intel® Mobile CM246 (Xeon®) / Intel® Mobile QM370 (Core™) | GRAPHICS CONTROLLER |
Intel® HD Graphics P630 for Xeon® processor Intel® HD Graphics 630 for Core™ processors | ETHERNET CONTROLLER |
Intel® I219LM | ETHERNET |
10/100/1000 MBit Ethernet |
Main Memory |
2x DDR4 SODIMM for up to 32 GByte ECC / non ECC on request: 4x DDR4 SODIMM for up to 64 GByte ECC / non ECC |
Ethernet Controller |
Intel® I210IT (uses one lane of PCIe 3.0) Intel® Quad 10GbE LAN integrated in SoC
|
Ethernet |
1x 10/100/1000 MBit Ethernet Up to 4x 10GbE Interfaces (KR) - depending on C3000 SKU NC-SI support
|
Hard Disk |
4x SATA 6Gb/s |
Flash Onboard |
Up to 1 TByte NVMe SSD (on request) | PCI EXPRESS® SUPPORT |
8x PCIe x1, 1x PEG x16
|
Serial |
2x serial interface (RX/TX only) |
PANEL SIGNAL |
DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit | USB |
4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 | AUDIO |
Intel® High Definition Audio |
Serial |
2x serial interface (RX/TX only) |
COMMON FEATURES |
SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe |
BIOS |
AMI Aptio V |
Humidity |
93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
|
FEATURES ON REQUEST |
vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM370 Chipset,
3rd/4th DDR4 SO-DIMM socket, NVMe SSD |
Power Management |
ACPI 6.0
|
Power Supply |
ATX, 8.5V - 20 V Wide Range, Single Supply Power |
Special Features |
POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions,
Flexible PEG lane configuration by Setup Option, Rapid shutdown (R E2S variants)
|
Operating System |
Windows® 10, Linux, VxWorks
|
Temperature |
Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
|
Supported Modules |
COMe-bCL6(R E2S) xx-xxxxx CM246/QM370
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